Liquid Flux

Tubular solders with SD-82 no-clean flux have increased wettability on difficult-to-solder surfaces such as OSP, Ni, Zn, nickel silver, as well as dirty surfaces. Rosin is included in the composition of the SD-82 flux to increase the flowability of the solder on the surfaces to be soldered. SD-82 flux contains a small amount of halogens and is therefore classified by IPC J-STD-004B as ROL1.

Tubular solders with SD-82 no-clean flux have increased wettability on difficult-to-solder surfaces such as OSP, Ni, Zn, nickel silver, as well as dirty surfaces. Rosin is included in the composition of the SD-82 flux to increase the flowability of the solder on the surfaces to be soldered. SD-82 flux contains a small amount of halogens and is therefore classified by IPC J-STD-004B as ROL1.

Tubular solders with SD-82 no-clean flux have increased wettability on difficult-to-solder surfaces such as OSP, Ni, Zn, nickel silver, as well as dirty surfaces. Rosin is included in the composition of the SD-82 flux to increase the flowability of the solder on the surfaces to be soldered. SD-82 flux contains a small amount of halogens and is therefore classified by IPC J-STD-004B as ROL1.